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YIK SHING TAT Industrial Co., Ltd.  

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Company Info

YIK SHING TAT Industrial Co., Ltd. [China (Mainland)]


City: Shenzhen City
Province/State: Zhejiang
Country/Region: China (Mainland)

Solder Pastes (Total 9 Products)

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  • Water-Soluble Solder Wire

Water-Soluble Solder Wire

Features:
1) Matching the water-clean process in modern electronic assembly, where ODS
materials should be phased out
2) Suitable for high-s

2005-11-11

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  • Rosin Based Solder Wire

Rosin Based Solder Wire

Features:
1) High quality rosin is selected to make this product
2) There are 3 kinds of rosin cores: R type (rosin only, low activity), RMA type

2005-11-11

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  • Lead-Free Solder Wires

Lead-Free Solder Wires

Features:
1) Meet the requirements of lead-free electronic assembly
2) Several lead-free solder wires available, including Sn-Cu, Su-Ag, Sn-Bi, Sn

2005-11-11

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  • No-Clean Solder Wire

No-Clean Solder Wire

Features:
1) To meet the requirements in "Montreal Protocol" that phases out the use of
CFCs solvent, and to satisfy the non-clean assembly of

2005-11-11

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  • Solder Wires

Solder Wires

Features:
1) With years of practice experience, we can satisfy requirements of smaller sizes
and higher integrating in modern electronic produ

2005-11-11

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  • Solder Paste

Solder Paste

Features:
1) For modern PCB-level electronic assembly using surface mount technology,
solder paste is widely used as the joining material
2)

2005-11-11

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  • Lead-Contained Solder Paste

Lead-Contained Solder Paste

Features:
1) Lead-contained solder paste
2) Alloy composition: Sn63 / Pb37, Sn62 / Pb36 / Ag2, Sn43 / Pb43 / Bi14
3) Sn 10/Pb88/Ag2
4) For mo

2005-11-11

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  • Lead-Free Solder Paste

Lead-Free Solder Paste

FLY805

Features:
1) Mildly activated resin-based formulation designed specifically to allow post-process
residues to be left on the PCB without degra

2005-11-11

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  • Lead-Free Solder Paste

Lead-Free Solder Paste

Features:
1) Lead-free solder paste
2) Alloy composition: Sn-3.5Ag, Sn-0.7Cu, Sn-Ag-Cu, Sn-58Bi
3) For modern PCB-level electronic assembly usin

2005-11-11

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