Features:
1) Mildly activated resin-based formulation designed specifically to allow post-process
residues to be left on the PCB without degradation
2) With a wide process window uncommon to most no-clean solder pastes, which
allows it to accommodate a variety of environments and process applications
3) Performs well in continuous production, offering good slump resistance, high tack,
and low post-process residues
4) The post soldering residues are compatible with ICT (In-Circuit Testing)
5) Maintains its activity and printing characteristics for up to 12 hours