Features:
1) Lead-free solder paste
2) Alloy composition: Sn-3.5Ag, Sn-0.7Cu, Sn-Ag-Cu, Sn-58Bi
3) For modern PCB-level electronic assembly using surface mount technology,
solder paste is widely used as the joining material
4) We have made a lot of efforts to develop solder paste with our own brand
5) With the aim to satisfy market requirements and follow the developing tendency
of environmental protection, systematical research works are being carried out